products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
MOS Capacitors
Created with Pixso.

Deep Level Trap Passivated MOS Capacitor HACC102S30V470 470pF 30V Zero C-V Hysteresis SLC

Deep Level Trap Passivated MOS Capacitor HACC102S30V470 470pF 30V Zero C-V Hysteresis SLC

Brand Name: Hoan
Model Number: HACC102S30V470
MOQ: 10 Pieces
Payment Terms: L/C,D/A,D/P,T/T
Detail Information
Place of Origin:
Shaanxi, China
Certification:
ISO 9001:2015, RoHS
Chip Dimensions:
0.50 X 0.50 X 0.15 Mm
Top Metallization:
Au, 2.5 Um Min
Backside Metallization:
Au, 1.0 Um Min
Operating Temperature:
-55°C To +125°C
RoHS:
EU 2015/863 Compliant
ESD Class:
Class 0 (HBM)
Mounting Type:
Wire Bondable / Eutectic Die Attach
Highlight:

Deep Level Trap Passivated MOS Capacitor

,

470pF 30V MOS Capacitor

,

Zero C-V Hysteresis SLC Capacitor

Product Description

Deep Level Trap Passivated MOS Capacitor HACC102S30V470 470pF 30V


Summary: The HACC102S30V470 is a 470 pF ±10%, 30 V DC single-layer MOS capacitor with a deep-level trap passivated Si/SiO2 interface. It is intended for RF matching, filtering and precision analog circuits where interface trap density, C-V hysteresis and long-term charge trapping affect stability.

Overview

The HACC102S30V470 is built on a float-zone silicon substrate (above 1000 Ω·cm) with a 300 nm thermal SiO2 dielectric and a hydrogen / forming-gas passivation anneal. The chip measures 0.50 × 0.50 × 0.15 mm with 2.5 µm minimum gold top metallization. It supports wire bonding and eutectic die attach.


Key Features

  • Deep-level trap passivation: Dit typically below 5 × 1010 cm-2 eV-1.
  • Zero C-V hysteresis: below 10 mV between up and down sweeps.
  • Charge trap elimination: low dielectric absorption and no DC bias derating.
  • 470 pF ±10% at 30 V DC with a near-linear TCC of +35 ppm/°C.
  • Single-layer construction with intrinsic ESL below 0.05 nH.
  • ISO 9001:2015 and RoHS compliant, wire bondable gold metallization.
  • Custom capacitance values available on the same 0.50 mm platform.

Electrical Specifications (T = 25°C unless noted)

Parameter Value Test Condition
Capacitance 470 pF ±10% 1 MHz, 1.0 Vrms
Capacitance Tolerance Options ±10% (K), ±5% (J)
Rated DC Voltage 30 V Continuous operation
Dielectric Strength Above 100 V DC 1 minute, 25°C
Interface Trap Density (Dit) Below 5 × 1010 cm-2 eV-1 Typical after passivation
C-V Hysteresis Below 10 mV Up/down bias sweep
DC Bias Coefficient Below 10 ppm/V 0-30 V
TCC +35 ppm/°C -55°C to +125°C
Q Factor at 1 MHz >2000 Typical
Leakage Current Below 10 nA 30 V DC, 25°C
Dielectric Thermal SiO2, 300 nm Passivated interface
Chip Dimensions 0.50 × 0.50 × 0.15 mm ±0.025 mm
Operating Temperature -55°C to +125°C


Typical Applications


  • Precision RF impedance matching and filter networks
  • Stable DC blocking in analog and mixed-signal front ends
  • VCO and reference circuits that require hysteresis-free tuning
  • Sample-and-hold and precision integrator stages
  • High-reliability industrial and instrumentation assemblies


Deep Level Trap Passivated MOS Capacitor HACC102S30V470 470pF 30V Zero C-V Hysteresis SLC