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Optimized Dielectric Relaxation Time MOS Capacitor 470pF 50V Single Layer Chip For Pulse Circuits

Optimized Dielectric Relaxation Time MOS Capacitor 470pF 50V Single Layer Chip For Pulse Circuits

Brand Name: Hoan
Model Number: HACC471S50V200
MOQ: 10 Pieces
Payment Terms: T/T,L/C,D/A,D/P
Detail Information
Place of Origin:
Shaanxi, China
Certification:
ISO 9001:2015, RoHS
Capacitance:
470pF ±10%
Top Metallization:
TiW + Au, 2.5µm Min
Mounting Type:
Wire Bondable / Eutectic Die Attach
Operating Temperature:
-55°C To +125°C
RoHS:
Compliant (EU 2015/863)
Customization:
Capacitance 10pF-1000pF, Geometry Up To 4:1, Bordered Electrode, Floating Backside
Highlight:

MOS capacitor 470pF pulse circuits

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single layer chip MOS capacitor 50V

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dielectric relaxation time MOS capacitor

Product Description

HACC471S50V200 Optimized Dielectric Relaxation Time MOS Capacitor — 470pF 50V Single Layer Chip

Product overview: The HACC471S50V200 is a single-layer metal-oxide-semiconductor (MOS) capacitor with a nominal capacitance of 470pF ±10% and a 50V DC working voltage. It uses a 300nm thermal silicon dioxide (SiO2) dielectric on a float-zone silicon substrate with a TiW-Au metallization stack. It is engineered around two properties: an optimized dielectric relaxation time and ultra-fast polarization relaxation, so that stored charge settles quickly after a fast pulse transition. This makes it suited to pulse and switching circuits where droop, settling time, and pulse-to-pulse repeatability matter.


What Is Dielectric Relaxation Time?


After a capacitor charges, the dielectric material needs a finite time to return to its equilibrium polarization state. That period is the dielectric relaxation time. If the dielectric relaxes slowly, residual charge from a previous pulse can affect the next pulse, producing amplitude droop or timing error in a pulse train. A capacitor with a short, well-controlled relaxation time and low dielectric absorption starts each pulse from a clean charge state, which improves repeatability in pulse-forming, sample-and-hold, and modulator circuits.


Key Specifications (T = 25°C unless noted)


Parameter Value Condition
Capacitance 470pF ±10% 1MHz, 1.0Vrms
Rated DC voltage 50V Continuous
Dielectric strength >125V DC 1 minute, 25°C
Dielectric absorption <0.1% Typical
Dielectric relaxation time Optimized (short time constant) Post-pulse recovery
Intrinsic chip ESL <0.05nH De-embedded from S-parameters
Q factor at 1MHz >2000 Typical
TCC +35ppm/°C -55°C to +125°C
Leakage current <10nA 50V DC, 25°C
Dielectric Thermal SiO2, 300nm
Substrate Float-zone Si, >1000 Ω·cm
Chip dimensions 0.50 × 0.50 × 0.15mm ±0.025mm
Top metallization TiW + Au, 2.5µm min Wire bondable
Backside metallization TiW-Pt-Au, Au 1.0µm min Die attach
Operating temperature -55°C to +125°C
RoHS Compliant EU 2015/863


Typical Applications


  • Pulse-forming and pulse-shaping networks
  • Fast sample-and-hold and peak-detector stages
  • Radar and LIDAR pulse modulators
  • Power-converter snubber and dV/dt clamping nodes
  • High-speed analog acquisition front-ends
  • Precision integrators and charge-transfer circuits


Optimized Dielectric Relaxation Time MOS Capacitor 470pF 50V Single Layer Chip For Pulse Circuits