HongAn Microwave Co., Ltd.
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| Brand Name: | Hoan |
| Model Number: | HALA-CUSTOM-MP |
| MOQ: | 10 Pieces |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
System-in-Package (SiP) and advanced micro-packaging technologies — from fan-out wafer-level packaging (FOWLP) to embedded die substrates — impose mechanical constraints on passive components that conventional SMD packages cannot meet. A 7nH bias choke that measures 2.0mm * 1.2mm in 0402 SMD format is physically impossible to integrate inside a 500µm-thick interposer or alongside a flip-chip die in a molded underfill cavity. Yet the electrical function — clean DC bias injection with >30dB RF isolation at 28GHz — remains mandatory.
The HALA-CUSTOM-MP addresses this fundamental mismatch between electrical requirements and packaging constraints. Built on the HALA precision automated winding platform — the same technology producing the HALA060-HALA200 series — the CUSTOM-MP variant offers coil geometries explicitly engineered for micro-packaging integration: sub-0201 footprints, ultra-low profile heights, compatible termination metallurgies, and process-ready formats for automated die-attach and wire bonding.
| Packaging Parameter | HALA-CUSTOM-MP Capability | Integration Benefit |
|---|---|---|
| Coil Volume | As small as 0.02 mm³ (sub-0201 footprint) | Embedded in substrate cavities, interposers, and mold compounds |
| Coil Height (Z-axis) | As low as 0.15 mm (wire diameter + single layer) | Fits within 500µm interposer height budget |
| Termination Format | Micro-stripped leads, gold flash pads, stud bump compatible | Ultrasonic wedge bonding, thermosonic ball bonding, AuSn eutectic |
| Substrate Compatibility | LTCC, HTCC, organic laminate, silicon interposer, glass core | No CTE mismatch issues — air core has zero substrate stress coupling |
| Mold Compound Compatibility | Zero outgassing, <1% TML per ASTM E595 | No void formation, no wire sweep during transfer molding |
| Coplanarity (Flip-Chip) | ≤±10µm on demand (ultra-precision laser profiling) | Thermocompression bonding yield >99.5% |
| Processing Temperature | Compatible with Pb-free reflow (260°C peak), AuSn eutectic (280°C) | No parametric shift after assembly thermal cycles |
Unlike ferrite chip inductors that require keep-out zones for magnetic field containment and exhibit permeability drift under mechanical stress from mold compound cure shrinkage, the air-core HALA-CUSTOM-MP has zero magnetic material — eliminating both the keep-out zone requirement and the stress-dependent inductance drift. The μ₀ = 1.0 free-space permeability is immune to mold compound cure stress, thermal expansion, and humidity, making it the only inductor technology that is truly SiP-ready without performance compromises.
In a production line placing 1 million inductors per month, a 1% yield loss means 10,000 rejected parts — and in SiP applications where the inductor is embedded during substrate fabrication, a single inductor failure rejects the entire multi-die module. Turn-to-turn consistency is not a statistical comfort metric; it is a hard production economics requirement.
The HALA precision automated winding platform enforces consistency at every process step:
| Process Step | Control Method | Consistency Metric |
|---|---|---|
| Mandrel Geometry | Precision-ground carbide mandrel, ±2µm diameter control | Coil ID variation <±0.5% across 100,000+ coils |
| Wire Tension | Closed-loop servo tensioner, 0.5–5.0gf programmable | Turn pitch uniformity <±1.5µm (3σ) |
| Turn Count | Encoder-verified per coil, not batch-sampled | 100% verification, zero turn count errors |
| Shape Retention | Active shape-lock during mandrel extraction | Coil deformation <0.5% of coil length |
| In-Line Optical Inspection | 6-axis machine vision, 2µm/pixel resolution | 100% coils imaged and checked for wire gap, pitch uniformity, lead symmetry |
| RF Electrical Test | Per-coil vector network analyzer measurement at production speed | Inductance ±3–4% natural Cpk >1.67 |
| S2P Lot Sampling | Full 2-port Touchstone, 100MHz–26.5GHz, 201 points | Per-production-lot statistical characterization |
This process control architecture delivers the Cpk required for automotive IATF 16949 and aerospace AS9100 production qualification, with full lot traceability from raw wire spool to finished coil.
Cost reduction in the RF supply chain rarely means negotiating a lower unit price on a BOM line item. It means eliminating an entire manufacturing step, a test insertion, or a qualification cycle. The HALA-CUSTOM-MP provides cost reduction by design:
Drop-In Replacement Path: Many ferrite chip inductors in bias tee and matching applications can be replaced with HALA air core equivalents — eliminating ferrite core cost, ferrite supply chain risk, and the temperature-dependent inductance derating that ferrite introduces. The cross-reference table maps common values to HALA platform equivalents:
| Application | Typical Ferrite Value | HALA-CUSTOM-MP Replacement | Benefit |
|---|---|---|---|
| GaAs PA Bias Choke (2–8GHz) | 6.8nH 0402 ferrite | HALA060: 6T, 7nH, zero saturation | No μᵣ temperature drift, no bias-dependent inductance collapse |
| 5G Beamformer Bias Tee (24–30GHz) | 3.9nH 0201 ferrite | CUSTOM-MP: 4T 0.30mm ID | Sub-0201 footprint, >20GHz SRF |
| mmWave LNA Matching (28–39GHz) | 2.2nH 01005 ferrite | CUSTOM-MP: 2T sub-0201 | Q≥100, zero core loss, embedded-in-substrate compatible |
| Optical Modulator Bias (DC–40GHz) | Choke + capacitor network | CUSTOM-MP: 100nH high-turn air core | Eliminates C-bypass network, saves 2 BOM lines + PCB area |
Total Cost of Ownership Impact: By eliminating ferrite supply chain dependency (single-source ceramic materials from limited global suppliers), eliminating bias-dependent inductance derating verification in production test, and reducing PCB keep-out zones, the HALA-CUSTOM-MP reduces system-level cost even when unit price parity with ferrite alternatives is maintained.
| Parameter | Value | Notes |
|---|---|---|
| Coil Volume | 0.02 mm³ – 60 mm³ | Sub-0201 to custom form factors |
| Coil Z-Height | As low as 0.15 mm | Single-layer air-spaced helix |
| Termination | Micro-stripped Au flash, stud bump pads | Ultrasonic/thermosonic bonding compatible |
| Flip-Chip Coplanarity | ≤±10 µm (ultra-precision option) | >99.5% thermocompression yield |
| Inductance Range | 2 nH – 500 nH | Application-specific |
| Turn Count | 2 – 50 turns | Precision automated winding |
| Tolerance | ±20% / ±10% / ±5% | Statistical binning at RF frequency |
| Frequency Range | 100 MHz – 20 GHz | Geometry dependent |
| Q Factor | ≥100 @ 1 GHz | Air-core, zero hysteresis loss |
| SRF | >20 GHz | Single-layer, εᵣ=1.0 |
| Current Rating | Up to 500 mA DC | Wire gauge dependent, zero saturation |
| Operating Temp | -55°C to +125°C | Full parametric compliance |
| Mold Compound Outgassing | <1% TML | ASTM E595 |
| Process Cpk (Inductance) | >1.67 | 100% per-coil RF measurement |
| Proto Lead Time | 5–7 business days | MOQ 10 pieces |
Q: Can the CUSTOM-MP be embedded inside an organic substrate during fabrication?
A: Yes. The coil is compatible with standard substrate lamination temperatures (180–200°C) and pressures (2–4 MPa). Specify gold flash termination for oxidation resistance during the substrate fabrication thermal cycles. The air core's zero-CTE mismatch with any substrate material eliminates the delamination risk associated with ferrite components.
Q: What is the minimum achievable coil volume for my SiP?
A: The smallest standard configuration uses a 0.30mm ID mandrel with 0.03mm wire and 2 turns — approximately 0.02mm³. Contact our application engineering team with your exact Z-height and footprint budget for a feasibility assessment.
Contact us with your SiP footprint budget, Z-height constraint, termination metallurgy, and assembly process for a rapid feasibility assessment. Micro-packaging samples ship in 5–7 business days with MOQ starting at 10 pieces.
