HongAn Microwave Co., Ltd.
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
polski
فارسی
বাংলা
ไทย
tiếng Việt
العربية
हिन्दी
Türkçe
indonesia
|
| Brand Name: | Hoan |
| Model Number: | HALA-CUSTOM-WT |
| MOQ: | 10 Pieces |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
The same 11nH air core inductor that serves a benchtop prototype hand-soldered onto a evaluation board must also function in a high-volume SMT line placing 10,000 units per hour, and in a hermetic hybrid microcircuit where ultrasonic wedge bonding is the only permissible interconnection method. Standard fixed-lead inductors serve exactly one of these three scenarios — forcing the design team to either accept assembly compromises or manage multiple part numbers for the same electrical function.
The HALA-CUSTOM-WT eliminates this fragmentation. Built on the HALA precision automated winding platform, it provides comprehensive lead forming, termination plating, wire material, and insulation grade customization — enabling a single electrical design to serve every assembly process in your manufacturing flow, from prototype to volume production.
| Configuration | Key Spec | Assembly Method | Best For |
|---|---|---|---|
| Straight Axial | ≥8.0mm, symmetrical, pre-tinned | Manual soldering, through-hole | Prototyping, low-volume, general purpose |
| Radial 90° Bent | Bent at coil root, 5.0mm legs | Horizontal PCB mount | Low-profile Z-height constrained layouts |
| SMD Flat-Top Coplanar | ≤±25µm coplanarity, 100% laser-profiled | Automated pick-and-place | High-volume SMT lines, >99.9% pick-up |
| Custom Bent-Leg | Per mechanical drawing | Custom fixture soldering | Specialized mounting, multi-plane assemblies |
| Micro-Stripped & Tinned | Stripped to root, minimal protrusion | Micro-soldering, ultrasonic wedge bonding | Hermetic modules, MMIC co-integration |
| Plating | Thickness | Solderability | Wire Bond | Best For |
|---|---|---|---|---|
| Electroless Tin | 3–8 µm | Excellent (SAC305) | Compatible | RoHS standard, general purpose |
| Electroplated Silver | 2–5 µm | Excellent (Ag-compatible solder) | Excellent | Lowest loss, highest conductivity |
| Gold Flash (Ni underlayer) | 0.05–0.2 µm Au | Good (Au-compatible solder) | Excellent | Corrosion resistance, hermetic, long shelf life |
| Solder-Dipped | Sn63/Pb37 or SAC305 | Immediate (pre-coated) | Not recommended | Legacy processes, no-clean flux-free assembly |
| Material | Purity | Conductivity | Best For |
|---|---|---|---|
| OFHC Copper (Standard) | 99.9% Cu | 100% IACS | General RF, base stations, indoor equipment |
| Silver-Plated Copper | 99.9% Cu core, 2–5µm Ag | ~106% IACS at RF | Lowest AC resistance above 10GHz, SATCOM, mmWave |
| Gold-Bonded Copper | 99.9% Cu core, Au flash | ~100% IACS | Wire bonding compatibility, corrosion-critical environments |
| Grade | Material | Continuous | Peak | Dielectric Strength | Best For |
|---|---|---|---|---|---|
| Class H (Standard) | Polyurethane Enamel | 180°C | 200°C | >100 V/µm | General RF, telecom, indoor equipment |
| Class C (High-Temp) | PTFE / Polyimide Enamel | 200°C | 240°C | >150 V/µm | Automotive under-hood, aerospace, downhole |
| Heavy Build (Thick) | Polyurethane + Nylon Overcoat | 155°C | 180°C | >200 V/µm | High-voltage bias tees, highest turn-to-turn isolation |
The standard polyurethane enamel provides excellent moisture resistance, solderability (strips cleanly at soldering temperatures without aggressive flux), and full RoHS/REACH compliance. For extreme environments, the PTFE/polyimide system extends continuous operation to 200°C with superior chemical resistance. The heavy-build option is available for applications where turn-to-turn voltage stress demands maximum dielectric margin — for example, 50V GaN PA bias tees where the peak RF voltage across the inductor approaches 100V.
The HALA-CUSTOM-WT shares the identical manufacturing platform with all HALA catalog products — the same 0.30mm precision mandrel, the same automated winding process with active shape retention, the same 100% in-line optical inspection, and the same S2P Touchstone characterization. This platform commonality provides two critical advantages:
Cross-Reference Compatibility: Start your design with a standard HALA0600503R (6T, 7nH, 400mA, straight leads, tin-plated, polyurethane enamel). Need gold flash leads for hermetic packaging? Need silver-plated wire for lower millimeter-wave loss? Need PTFE insulation for 200°C operation? The CUSTOM-WT platform provides the migration path — same electrical performance, customized terminations and materials — without changing your matching network topology or PCB footprint.
Prototype-to-Production Continuity: Custom termination and wire configurations ship as evaluation quantities within 5–7 business days, from the same platform that serves production volumes. The S2P data measured on your prototype parts is the S2P data you will measure on production parts — no process change, no package change, no performance discontinuity.
| Parameter | Value | Notes |
|---|---|---|
| Lead Configurations | Axial, radial, SMD flat-top, bent-leg, micro-stripped | Per mechanical drawing |
| Termination Plating | Sn, Ag, Au flash, solder-dipped | Independent of lead configuration |
| Lead Coplanarity (SMD) | ≤±25 µm | 100% laser-profiled |
| Wire Material | OFHC Cu, Ag-plated Cu, Au-bonded Cu | >99.9% pure copper core |
| Insulation Grades | Class H (180°C), Class C (200°C), Heavy Build (155°C) | Polyurethane, PTFE/Polyimide, Nylon overcoat |
| Insulation Dielectric Strength | >100 V/µm (std), >150 V/µm (PTFE), >200 V/µm (heavy) | Turn-to-turn breakdown voltage |
| Wire Diameters | 0.03, 0.05, 0.08, 0.10 mm | Enameled, per insulation grade |
| Coil ID Range | 0.3 mm – 5.0 mm | Customizable |
| Turn Count | 4 – 50 turns | Precision automated winding |
| Inductance Range | 2 nH – 500 nH | Application-specific |
| DC Current Rating | Up to 500 mA | Wire gauge dependent, zero saturation |
| Frequency Range | 100 MHz – 20 GHz | Geometry dependent |
| Operating Temp | -55°C to +125°C (std), +200°C (PTFE) | Full parametric |
| Compliance | RoHS, REACH, Halogen-Free, CM-Free | Per-lot documentation |
| Test Data | S2P Touchstone per lot | 100MHz–26.5GHz, 201 points |
| Proto Lead Time | 5–7 business days | MOQ 10 pieces |
Q: Can I specify different plating on each lead (asymmetric termination)?
A: The standard process plates both leads identically for process simplicity and consistency. Asymmetric plating (e.g., one lead gold flash for wire bonding, the other tin for soldering) is available on request. Contact engineering with your requirements.
Q: How does silver-plated wire improve performance at mmWave frequencies?
A: At 20GHz, the skin depth in copper is approximately 0.46µm. Silver has approximately 6% higher conductivity than copper at DC, and at RF frequencies where current flows only in the outer surface, the 2–5µm silver plating carries essentially all the RF current. The result is 5–8% lower effective AC resistance compared to bare copper of the same diameter, directly improving Q factor and reducing insertion loss.
Q: Is the PTFE/polyimide insulation compatible with standard soldering temperatures?
A: Yes. PTFE/polyimide insulation withstands brief soldering temperature exposure (≤260°C, ≤3s) without degradation. It strips cleanly at the lead ends during the factory tinning process, leaving the solderable copper exposed for termination.
Contact us with your mechanical drawing, target specifications, termination requirements, and operating environment for a rapid feasibility assessment. Custom configurations ship in 5–7 business days with MOQ starting at 10 pieces.
