26nH Air Core Inductor Coils Eco Friendly Air Core Coil RoHS

HALA1200303R 26nH Air Core Inductor Micro-MEMS Embedding Compatible Eco-Friendly RoHS Compliance 12T Precision Coil

Micro-MEMS Embedding: When Chip Inductors Are Simply Too Large

As RF systems shrink — from shoebox-sized remote radio units to credit-card-sized phased-array tiles to chip-scale beamformers — the physical size of passive components becomes the hard limit on integration density. An 0201 SMD ferrite inductor (0.6*0.3*0.3mm) occupies 0.054mm³ of PCB real estate — a volume that cannot shrink because the ferrite core requires a minimum magnetic cross-section to avoid saturation at rated current. In a 64-element phased-array with four inductors per element, 256 SMD inductors consume over 13mm³ — real estate that cannot be recovered by any PCB layout optimization.

The HALA1200303R 26nH ±20% 12-turn air core inductor breaks through this size barrier. At Ø0.30*0.50mm (0.035mm³ total volume, approximately 0.5mg mass), it is 35% smaller by volume than an 0201 SMD — and unlike the SMD, it can be embedded directly into the hybrid microcircuit substrate rather than surface-mounted on top. The 0.03mm (30µm) enameled copper wire — less than half the diameter of a typical human hair — is drawn with ±2µm diameter tolerance under in-line laser micrometer control. This wire is fine enough to be handled with the same micro-positioning equipment used for semiconductor die placement (typically ±5µm placement accuracy), enabling co-integration with GaAs and GaN MMIC die on the same AlN or alumina carrier substrate.

Embedding and Assembly Compatibility

The HALA1200303R supports two complementary assembly methods, enabling integration into diverse module architectures:

• Micro-soldering: Pre-stripped and tinned leads accept SAC305 lead-free or Sn63/Pb37 solder with ≤260°C tip temperature and ≤3-second dwell. The tinned surface wets within 1 second, forming reliable fillets with minimal thermal exposure to the 30µm wire. Compatible with automated micro-soldering stations using vision-guided positioning.
• Ultrasonic Wedge Bonding: The tinned copper leads present an excellent surface for 25µm aluminum ultrasonic wedge bonding at room temperature. This enables direct die-to-inductor interconnection without solder — critical for processes where soldering temperatures are incompatible with adjacent temperature-sensitive components or where flux residue is prohibited (e.g., optical modules, hermetic packages).
• Die-Attach Floorplanning: At 0.50mm total coil length with leads, the HALA1200303R can be placed between MMIC die on a multi-chip carrier with 1.0mm die-to-die spacing. Two HALA120 inductors placed between three GaAs PA die create a compact bias tee pair without increasing carrier dimensions.
• Hermetic Module Compatibility: The air-core inductor generates zero outgassing — there is no organic binder, no ferrite binder, and no epoxy encapsulant to release volatile compounds under vacuum bake-out. The 0.03mm enameled copper wire and tinned leads are inherently vacuum-compatible, meeting the <1% total mass loss (TML) requirement for hermetic hybrid modules.

100% Eco-Friendly and RoHS Compliance: Documentation, Not Claims

Environmental compliance in the electronics supply chain has moved from a marketing checkbox to a regulatory requirement with legal and financial consequences. The HALA1200303R is supported by per-lot compliance documentation that enables your product's regulatory submissions:

Compliance documentation is integrated into the lot traveller system — not generated as a post-hoc declaration. Every production lot ships with a compliance certificate summarizing RoHS status, REACH SVHC status, halogen content, and conflict minerals sourcing. This documentation package supports customer-facing regulatory declarations (CE technical file, UKCA, supplier declarations of conformity) without requiring independent material testing by the customer.

The Eco-Friendly Materials Advantage: Nothing to Regulate

The HALA1200303R achieves full compliance through materials simplicity, not through regulatory exemptions or substitution of problematic materials. The entire bill of materials consists of three substances:

• Copper (Cu): 99.9% pure oxygen-free copper wire, 0.03mm diameter. Copper is not a restricted substance under any major electronics regulation. It is infinitely recyclable and carries no hazardous classification.
• Polyurethane enamel: A thin (<5µm) insulating coating applied during wire drawing. The specific formulation is free of restricted phthalate plasticizers, halogenated flame retardants, and heavy-metal pigments. Decomposition products under soldering temperatures are CO₂, H₂O, and trace nitrogen oxides — all below occupational exposure limits.
• Tin (Sn): Pure tin electroplating on the lead ends. Tin is conflict-mineral-reportable under Dodd-Frank §1502 and is sourced exclusively from conflict-free smelters. Tin is not a restricted substance under RoHS or REACH.

This material simplicity also benefits end-of-life recycling. Unlike ferrite chip inductors that contain a complex ceramic-ferrite composite body with internal nickel electrodes — materials that are difficult to separate and recycle — the HALA1200303R's copper-tin-polyurethane composition is fully compatible with standard copper recycling streams.

Key Specifications

Assembly for Hybrid Microcircuits

• Microscope Handling: The 30µm wire is hair-thin. All handling under ≥20* stereomicroscope with anti-static ceramic-tip tweezers. Grasp leads only — the 12-turn coil body must not be mechanically contacted.
• Ultrasonic Wedge Bonding: 25µm Al wire at room temperature, 20-30gf force, 40-80mW ultrasonic power. The tinned copper lead surface provides excellent bonding adhesion without heating the stage.
• Micro-Soldering: SAC305 or Sn63/Pb37. Tip ≤260°C, ≤3s dwell. Direct hot-air impingement on the coil body prohibited — the 30µm wire enamel degrades at ~300°C.
• Cleanliness: Post-assembly clean with ≥99% IPA. Inspect under microscope for flux residue between turns. Hermetic modules require no-clean flux or full solvent extraction to meet <0.01% residual contamination limits.
• Fixation and Outgassing: Micro-droplet of low-dielectric RF adhesive (Epotek H20E, εᵣ <3.0). Verify S-parameters post-cure. For hermetic modules, outgassing testing per MIL-STD-883 Method 5011 confirms the assembled inductor meets <1.0% Total Mass Loss (TML) and <0.1% Collected Volatile Condensable Material (CVCM) — the standard acceptance criteria for space-grade hybrid microcircuits. The air-core inductor itself (Cu, Sn, polyurethane) contributes effectively zero to TML; the fixation adhesive is the sole outgassing source and is selected specifically for its low-CVCM formulation.

Applications

• Phased-Array Tile Sub-Arrays: 0.5mg mass and 0.035mm³ volume enable 256-inductor bias tee arrays within a postage-stamp-sized multi-chip carrier. Ultrasonic wedge bonding enables flux-free assembly compatible with hermetic lid-seal processes.
• Chip-Scale Beamformers: Direct embedding alongside GaAs core chips on AlN or alumina carriers. Wire-bondable leads eliminate SMD pad requirements, saving carrier area for additional active circuitry.
• Hermetic Optical Modules (TOSA/ROSA): Zero outgassing (<1% TML) meets hermetic packaging requirements. 26nH bias choke for laser driver bias injection at 100-200mA with flat passband across DC-18GHz.
• SATCOM Terminal LNBs and BUCs: Full regulatory compliance (RoHS, REACH) supports CE/UKCA marking for commercial SATCOM terminals. Radiation-immune operation for LEO/MEO satellite applications.
• ECM/EW Broadband Receivers: 1.5-18GHz continuous coverage with flat passband and radiation immunity supports instantaneous-frequency-measurement (IFM) and channelized receiver front-ends where passive component nonlinearity would create spurious responses.
• Eco-Certified IoT Edge RF Modules: Full RoHS/REACH/halogen-free/conflict-mineral-free compliance supports green procurement policies and ISO 14001 environmental management system certification for high-volume IoT radio module production.

Contact us for evaluation samples, full compliance documentation packages, outgassing test reports, and S2P Touchstone characterization data for your specific frequency band.