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150pF 20V MOS Capacitor Halogen Free Ceramic Chip Capacitor With S Parameter Data

150pF 20V MOS Capacitor Halogen Free Ceramic Chip Capacitor With S Parameter Data

Brand Name: Hoan
Model Number: HACC151S20V101
MOQ: 10 Pieces
Payment Terms: L/C,D/A,D/P,T/T,Western Union
Detail Information
Place of Origin:
Shannxi, China
Certification:
ISO 9001:2015, RoHS, REACH, Halogen-Free
Capacitance:
150pF ±10%
Voltage Rating:
20V DC
Dielectric:
Thermal SiO₂, 300nm
Chip Dimensions:
0.50 X 0.50 X 0.15mm
Backside Metallization:
TiW-Pt-Au, Au 1.0µm Min
Operating Temperature:
-55°C To +125°C
Mounting Type:
Wire Bondable / Eutectic Die Attach
Highlight:

150pF MOS Capacitor

,

20V MOS Capacitor

,

Halogen Free Ceramic Chip Capacitor

Product Description

HACC151S20V101 Compliance-Verified MOS Capacitor: Halogen-Free 150pF with Full Metrology Traceability

The HACC151S20V101 is a 150pF ±10% single-layer MOS capacitor rated at 20V DC, sharing the float-zone silicon substrate, 300nm thermal SiO2 dielectric, and TiW-Au metallization platform. Chip dimensions are 0.50mm * 0.50mm * 0.15mm. This variant is engineered for customers requiring documented regulatory compliance, measurement traceability to national standards, and comprehensive materials provenance data as part of their component qualification process.

1. Regulatory Compliance Framework for Electronic Passive Components

Modern electronics supply chains must navigate a multi-layered regulatory landscape. The HACC151S20V101 is designed and documented to satisfy the key frameworks applicable to passive components:

  • EU RoHS Directive 2011/65/EU (recast 2015/863): Restricts lead, mercury, cadmium, hexavalent chromium, PBB, PBDE, DEHP, BBP, DBP, and DIBP to maximum concentration values of 0.1% by weight in homogeneous materials (0.01% for cadmium). The HACC151S20V101 is intrinsically RoHS-compliant at the materials level—the silicon substrate, SiO2 dielectric, TiW barrier, Au electrodes, and Pt barrier contain none of the restricted substances by design. The optional AuSn pre-deposition uses gold-tin eutectic, not tin-lead, preserving RoHS compliance.
  • Halogen-free per IEC 61249-2-21: Defines halogen-free as chlorine <900ppm, bromine <900ppm, and total chlorine+bromine <1500ppm. Verification is performed by combustion ion chromatography (CIC) on homogenized chip samples from each materials lot, with detection limits below 50ppm for each halogen. The all-inorganic materials set—silicon, SiO2, TiW, Au, Pt, AuSn—contains no halogens by composition, eliminating the need for ongoing lot-by-lot screening for these elements.
  • EU REACH Regulation (EC) 1907/2006: The Candidate List of Substances of Very High Concern (SVHC) is updated by ECHA twice yearly (typically January and July). Each production lot is screened against the then-current Candidate List. A declaration of conformity confirming absence of listed SVHCs above 0.1% w/w per article is available. For customers integrating the capacitor into products sold in the EU, this declaration supports their own REACH Article 33 communication obligations.
  • EU WEEE Directive 2012/19/EU: While WEEE primarily targets finished electronic equipment, the absence of halogenated flame retardants and the use of easily separable, non-toxic materials in the HACC151S20V101 support end-of-life recycling and recovery targets set by the Directive.

2. S-Parameter Metrology: Measurement Science and Traceability

The S-parameter data provided with each lot is not simply a representative measurement—it is the output of a defined metrology process traceable to national calibration standards:

  • VNA calibration chain: Measurements are performed on a calibrated vector network analyzer (Keysight PNA-X or equivalent) using a ground-signal-ground (GSG) wafer probe station. The calibration sequence uses an impedance standard substrate (ISS) with Thru-Reflect-Line (TRL) or Short-Open-Load-Thru (SOLT) standards. The ISS standards are characterized by the manufacturer with traceability to NIST (National Institute of Standards and Technology) through a cascade of mechanical and electrical transfer standards.
  • De-embedding methodology: Raw S-parameter measurements include the effects of the probe pads and the interconnect between the VNA reference plane and the device under test (DUT). A two-step de-embedding process is applied: first, pad parasitic capacitances and inductances are removed using open-short de-embedding structures fabricated on the same wafer. Second, any residual probe-to-pad contact resistance is calibrated out using thru structures. The resulting de-embedded S-parameters represent the intrinsic chip behavior at the electrode plane.
  • Measurement uncertainty budget: The combined standard uncertainty for S21 magnitude (series configuration) is typically ±0.05dB below 10GHz, increasing to ±0.15dB at 20GHz. Capacitance derived from S-parameters (C = -1/(2πf·Im(Z11)) typically agrees with the 1MHz C-V measurement within ±2% at low frequencies, confirming consistency between DC and RF characterization methods.
  • Data format and delivery: S-parameter data is provided as Touchstone version 1.1 (.s2p) files with frequency points spaced logarithmically (100 points per decade) from 100MHz to 20GHz. File headers include measurement date, instrument model, calibration method, probe type, bias conditions, and temperature. Files are compatible with all major RF simulation platforms including Keysight ADS, Ansys HFSS, Cadence AWR Microwave Office, and open-source tools such as scikit-rf.

3. Materials Provenance and Supply Chain Integrity

Beyond regulatory compliance, the HACC151S20V101 supports customers' broader responsible sourcing commitments:

  • Conflict minerals (Dodd-Frank Section 1502 / EU Regulation 2017/821): The gold used in the top and backside metallization is sourced exclusively from London Bullion Market Association (LBMA) Good Delivery List refiners that are also certified under the Responsible Minerals Assurance Process (RMAP). The CMRT (Conflict Minerals Reporting Template, currently version 6.4) is completed annually and available on request. The template covers tin, tantalum, tungsten, and gold (3TG) originating from the Democratic Republic of Congo and adjoining countries.
  • Full Material Disclosure (FMD): For customers requiring complete materials composition data—for example, to populate their own product-level lifecycle assessment (LCA) or to verify compatibility with specific chemical exposure environments—IPC-1752A Class D declarations are available under non-disclosure agreement. These declarations list every intentionally added substance in the component, with CAS numbers and mass ranges, at the homogeneous material level.
  • Silicon wafer provenance: Float-zone silicon wafers are sourced from qualified suppliers with ISO 9001:2015 and IATF 16949 certifications. Wafer lot traceability is maintained through fabrication, with each finished chip traceable to the ingot, crystal growth run, and wafer position through the serialized lot traveller system.

Key Features

  • 100% Halogen-Free and RoHS/REACH Compliant: Verified halogen content <50ppm each by CIC. Full RoHS 2015/863 and REACH SVHC compliance declarations per production lot. IPC-1752A Class D FMD available under NDA.
  • Full S-Parameter Metrology Package: VNA characterization 100MHz-20GHz with NIST-traceable TRL/SOLT calibration. Touchstone .s2p files with open-short de-embedded data. Measurement uncertainty budget documented. Compatible with Keysight ADS, Ansys HFSS, Cadence AWR, and scikit-rf.
  • Verified Materials Supply Chain: RMAP-certified gold supply. CMRT 6.4 conflict minerals reporting. Float-zone silicon wafer lot traceability to ingot level. ISO 9001:2015 and IATF 16949 qualified wafer suppliers.
  • Superior Thermal Performance: 148 W/m·K silicon substrate, θJC <30 K/W with AuSn attach. Under 1.5°C junction rise at typical operating power.
  • Data Retention: Lot-specific test data, S-parameters, and materials declarations retained for minimum 5 years, supporting long-lifecycle infrastructure and industrial programs.

Electrical Specifications (T = 25°C unless noted)

Parameter Value Condition
Capacitance 150pF ±10% 1MHz, 1.0Vrms
Available Tolerances ±10% (K), ±5% (J)
Rated DC Voltage 20V Continuous
Dielectric Strength >100V DC 1 min, 25°C
Intrinsic ESL <0.05nH De-embedded
SRF (0.5mm bond wire) >5GHz Typical
Q @ 1MHz / @ 1GHz >2000 / >250 Typical
Leakage @ 25°C / @ 125°C <10nA / <100nA 20V DC
TCC +35ppm/°C -55°C to +125°C
θJC (AuSn attach) <30 K/W 0.50mm chip
Halogen Content (Cl, Br, total) <50ppm each, <100ppm total CIC, IEC 61249-2-21
S-Parameter Uncertainty (|S21|) ±0.05dB <10GHz, ±0.15dB @ 20GHz k=2 coverage factor
Dielectric Thermal SiO2, 300nm
Substrate Float-zone Si, >1000Ω·cm IATF 16949 supplier
Chip Dimensions 0.50 * 0.50 * 0.15mm ±0.025mm
Top / Backside Metallization TiW+Au 2.5µm / TiW-Pt-Au 1.0µm RMAP gold supply
Operating / Storage Temp -55 to +125°C / -65 to +150°C
RoHS / REACH / Halogen-Free Compliant, declarations per lot EU 2015/863, EC 1907/2006, IEC 61249-2-21

Documentation Deliverables Matrix

Document Standard/Format Content Summary Included
Lot Test Summary Internal format C histogram, Ileak distribution, BV stats, representative S-parameter plots Standard with every shipment
S-Parameter Data Touchstone .s2p v1.1 De-embedded 2-port S-params, 100MHz-20GHz, 100pts/decade, with metadata header Standard with every shipment
RoHS Declaration EN 50581:2012 Confirmation of conformity to EU 2011/65/EU + 2015/863 Standard with every shipment
REACH SVHC Declaration Per ECHA Candidate List Confirmation of SVHC absence above 0.1% w/w threshold Standard with every shipment
Halogen-Free Certificate IEC 61249-2-21 Cl, Br, and total halogen content by CIC Standard with every shipment
Full Material Disclosure IPC-1752A Class D All intentionally added substances by homogeneous material, with CAS numbers On request, NDA required
Conflict Minerals Report CMRT 6.4 3TG smelter/refiner identification and country of origin On request
PPAP Documentation Per AIAG PPAP manual Production Part Approval Process Level 3 package On request, MOQ applies
First Article Inspection AS9102 or ISO equivalent Dimensional, electrical, and visual FAI report On request

Typical Applications

  • Medical device electronics (IEC 60601 compliance programs) requiring full materials disclosure for biocompatibility risk assessment and regulatory submission packages
  • Telecommunications infrastructure (NEBS Level 3, ETSI environmental standards) where halogen-free procurement policies are enforced by network operators
  • Automotive electronic control units requiring PPAP Level 3 documentation as part of the production part qualification process
  • Scientific and metrology-grade instrumentation where component S-parameter traceability supports system-level measurement uncertainty analysis
  • High-reliability industrial controls with 10-15 year service life requiring guaranteed long-term documentation availability
  • Sustainability-focused product lines where conflict minerals reporting and halogen-free status are marketing and compliance requirements

Ordering and Qualification Support

Standard shipments include the Lot Test Summary, S-parameter data, RoHS declaration, REACH SVHC declaration, and halogen-free certificate. For programs requiring PPAP, FAI, or full material disclosure, specify documentation requirements at the RFQ stage. Our quality team can provide sample documentation packages for evaluation prior to order placement.

Contact us to discuss your compliance documentation, metrology, or materials traceability requirements.