| Brand Name: | Hoan |
| Model Number: | HACC-CUSTOM-TH |
| MOQ: | 10 Pieces |
| Payment Terms: | L/C,D/A,D/P,T/T,Western Union |
Hybrid circuits and RF modules using alumina (Al₂O₃, CTE 6.7 ppm/°C) or aluminum nitride (AlN, CTE 4.5 ppm/°C) substrates experience significant thermal stress at component-substrate interfaces during temperature cycling. Standard conical inductors with non-matched metal terminations develop solder joint cracks, wire bond lift-off, and inductance drift after repeated thermal exposure. The HACC-CUSTOM-TH eliminates this failure mode through CTE-matched metallization: the base termination alloy and wire coating are selected to match the customer's substrate CTE within ±1.5 ppm/°C. After 1,000 thermal cycles from -55°C to +125°C, DCR shift is maintained below 1%, wire bond pull strength remains above 3.0 g, and no solder joint cracking is observed — validated per industry-standard thermal cycling methodology.
High-power GaN and GaAs power amplifier bias-tees require the DC-feed inductor to carry 1A to 2A of continuous bias current without excessive voltage drop or thermal rise. The HACC-CUSTOM-TH achieves DCR below 0.3 Ohm for 100 nH inductance and below 1.0 Ohm for 500 nH — approximately 4–6* lower than standard fine-wire conical inductors. This is achieved through a fat-wire option with copper wire diameter from 0.10 mm to 0.15 mm, gold-flashed for bondability. Continuous current handling reaches 2A with temperature rise maintained below 20°C. Critically, inductance remains stable within ±5% from 0 mA to 1A DC bias — no saturation-induced inductance collapse because the air-core architecture is inherently linear.
The conical inductor apex — the small-diameter end that connects to the RF line — is the most challenging assembly point. Standard apex diameters of 0.4–0.8 mm are too large for precision eutectic soldering, and inconsistent tip geometry causes variable solder fillet quality. The HACC-CUSTOM-TH addresses this with a precision laser-cut micro-tip below 0.3 mm diameter, pre-tinned with AuSn (80Au/20Sn) solder cap 3–5 µm thick over a TiW-Au diffusion barrier. The flat laser-cut face and controlled solder volume ensure >95% wettability during 280°C eutectic reflow — producing a consistent, inspectable solder fillet without solder bridging to adjacent structures. This micro-tip eutectic interface is compatible with automated eutectic die attach equipment and eliminates the need for conductive epoxy at the critical RF connection point.
| Parameter | Value |
|---|---|
| CTE Matching | Alumina 6.7 ppm/°C, AlN 4.5 ppm/°C, or customer substrate, ΔCTE <±1.5 ppm |
| Thermal Cycling | 1,000 cycles -55/+125°C, <1% DCR shift, no solder joint cracking |
| DCR (100 nH) | <0.3 Ohm |
| DCR (500 nH) | <1.0 Ohm |
| Current Rating | 1A–2A continuous, fat-wire 0.10–0.15 mm Cu |
| Micro-Tip Diameter | <0.3 mm, AuSn pre-tinned, laser-cut flat face |
| Eutectic Temperature | 280°C (AuSn), wettability >95% |
| Inductance | 50 nH–500 nH, ±10% |
| Frequency Range | 100 MHz–40 GHz |
| SRF | >40 GHz |
Contact us with your substrate CTE, bias current, and eutectic requirements. CTE-matched conical inductors with ultra-low DCR and eutectic micro-tip ship in 5–7 business days.