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Broadband Inductors
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1000nH Broadband Inductors Micro Wire Metal Inductor 25MHz - 40GHz

1000nH Broadband Inductors Micro Wire Metal Inductor 25MHz - 40GHz

Brand Name: Hoan
Model Number: HALT50005
MOQ: 10
Payment Terms: L/C,D/A,Western Union,D/P,T/T
Detail Information
Place of Origin:
china
Commercial PN:
HALT50005
Product Category:
Broadband Conical Inductor
Inductance:
1000 NH ± 20%
Qualityfactor:
Q Factor At A Given Frequency
Height:
Specified In Millimeters Or Inches
Corematerial:
Ferrite Or Powdered Iron
Highlight:

1000nH Broadband Inductors

,

Micro Wire Metal Inductor

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40GHz Broadband Inductors

Product Description

High-Frequency Technical Summary
   The HALT50005 is an extraordinary, high-inductance, and ultra-broadband Conical Inductor designed for millimeter-wave RF bias networks, high-speed optoelectronics (up to 40 Gbps/100 Gbps), and high-frequency broadband bias-tees. Offering an outstanding nominal inductance of 1000 nH (1.0 µH) ± 20% and operating over an unprecedented frequency spectrum of 25 MHz to 40.0 GHz, this inductor is wound with one of the thinnest wire diameters in the industry—0.05 mm (50 µm)—and supports a continuous DC current of 250 mA.

   In ultra-broadband systems, achieving continuous isolation from low frequencies (down to 25 MHz) to millimeter-wave bands (up to 40 GHz) normally requires cascading multiple inductors of different values, which inevitably introduces destructive parasitic resonances. The HALT50005 resolves this challenge by providing a high 1000 nH inductance combined with a tapered conical architecture. The continuous change in winding diameter smoothly distributes parasitic capacitance, providing a flat, resonance-free high-impedance response over the entire 25 MHz to 40 GHz bandwidth.


Key Performance Advantages
   Extreme Broadband Range (25 MHz - 40 GHz): Provides continuous, flat RF shielding from low MHz up to millimeter-wave frequencies, replacing multiple cascaded inductors.
   Micro-Wire Winding (0.05 mm): Wound with ultra-fine 50 µm copper wire, enabling a high turn count to achieve 1000 nH (1.0 µH) while maintaining an ultra-compact mechanical footprint.
   Eliminates Cascade Resonances: A single-component solution that suppresses signal dips and phase distortions commonly caused by multi-stage inductor biasing.
   Air-Core Saturation Protection: Prevents magnetic saturation at high power levels, ensuring absolute inductance stability and high-Q performance under varying temperatures.
   Solderable Flying Leads: Equips standard solderable gold/tin-plated copper flying leads on both small and large ends, providing easy integration onto microwave microstrips.


Overall Dimensions

1000nH Broadband Inductors Micro Wire Metal Inductor 25MHz - 40GHz


Comprehensive Parameter Datasheet

Specifications Category Technical Parameter Name Guaranteed Values Testing / Measurement Conditions
Electrical Specs Nominal Inductance 1000 ηH (+20% Tolerance @ 10 MHz,0.1Vrms, 25°C)
Self-Resonant Frequency (SRF) >40.0 GHz (Flat, resonant-free high- impedance curve)
Maximum Continuous Current 250 mA (Rated at ΔT < 15°C temperature rise)
Recommended Frequency Band 0.025-40.0 GHz (Broadband RF decoupling,Millimeter-wave Bias-Tee)
Tested Frequency Band 0.01-40.0 GHz (With calibration fixture compensation)
Physical Geometry Overall Coil Length 3.0 mm (Typical length of the wound cone section)
Nominal Winding Wire Diameter 0.05 mm (Ultra-fine copper wire for maximum turns)
Optional Wire Diameter 0.08

mm (Custom low-DCR option for higher current)

Design Architecture Air-core Conical Coil

Tapered winding with dual straight flying leads

Assembly Processes Mount Style Flying Lead Welding Suitable for eutectic soldering /micro-soldering
Adhesive Stabilization Epoxy Glue Fixing Must be dot-epoxied to prevent vibration
Reliability & Quality Operating Temperature -55 to +125 °C (Industrial & Strategic Grade)
Storage Temperature & RH 20-25°C, 40%-60% RH Cleanroom environment


Multi-Frequency Operational Performance Breakdown
The HALT50005 undergoes strict vector network analyzer (VNA) testing using microstrip calibration fixtures. Itsbroadband impedance and attenuation performance are categorized into three major frequency segments:

Frequency Spectrum Attenuation/ImpedanceCharacteristic Technical Application & Fixture Engineering Notes
10 MHz - 500MHz Extremely high inductive reactance;insertion loss < 0.15 dB. Outstanding low-frequency transition blocking;isolates power supplies from noise starting at 25MHz.
10 MHz -20GHz Flat, continuous isolation curve; nomajor dip or resonant peak. Delivers robust > 1.8 kO RF isolation; perfect forhigh-speed telecom transceivers.
10 MHz -40GHz Outstanding high-frequencyresponse; maintains shielding up to40 GHz. Verified millimeter-wave performance; microstrip layout must minimize parasitic pad capacitance toprevent degradation.


Microwave Micro-Assembly & Installation Guide
   To preserve millimeter-wave signal integrity and prevent physical damage to the delicate copper wire, assembly operators must strictly follow this SOP:


Physical Alignment & Orientation
    Cone Tip Orientation: The small end of the conical inductor must point downward and be positioned perpendicular (≈90°) to the RF transmission microstrip line.
    Lead-Wire Length: Keep the flying lead from the small end (tip) as short as possible (ideally <0.3 mm to the microstrip). At 40 GHz, even a 0.5 mm lead wire acts as a significant parasitic inductor, introducing unwanted reflection and signal degradation.
    Physical Fixation: Conical inductors must be secured to the substrate using a small dot of non-conductive, low-outgassing epoxy (e.g., Epotek H70E or H65) on the side of the winding. This prevents resonant microphonic vibrations and mechanical failure under high-vibration environments.


Micro-Soldering and Welding SOP
    Soldering Temperature: Controlled micro-soldering tip temperature should be 280℃−320℃ for a duration of ≤2 seconds to prevent enamel degradation or melting of the ultra-fine 0.05mm copper wire.
    Lead-Free Compliance: Fully compatible with lead-free SAC305 solder and high-melting-point eutectic gold-tin (AuSn) or lead-tin (PbSn) solder alloys.